IQxstream-M
Multi-DUT Mobile & IoT Test System
IQxstream-M™, multi-DUT manufacturing test solution capable of calibration and verification of 2G/3G/4G devices and IoT modules operating on NB-IoT, Wi-Fi, Bluetooth®, Zigbee.
Its ultra-compact design and flexible architecture makes it highly suitable for high volume manufacturing of smartphones, tablets and cellular IoT modules.
Simple Setup with Higher Production Throughput
- Simplifies manufacturing test of complex smartphone technologies
- Provides 32 RF ports for parallel testing with direct connections to the DUT antenna, reducing the complexity of the test setup by eliminating external components
- Delivers industry-leading high manufacturing yield with its best-in-class VSA power accuracy
Ideally Suited for Mobile & IoT requirements
- No external components required for test setup
- Easy application setup expedites test solution deployment
- Versatile test solution, with comprehensive coverage of all mobile device wireless cellular and connectivity technologies
- Optimized for high-end and high-volume mobile device manufacturing
- Maximizes up-time with Factory Efficiency features, which detect and diagnose potential fixture issues
- Hardware options for single device, multi-device and MIMO testing allow for system configuration customization
Comprehensive LTE NB-IoT Chipset Support
- IQxstream-M is designed into all of the leading IoT chipset company software tools, providing simple bring-up and deployment of LTE IoT devices
Cellular, IoT and Connectivity Technology Options
- GSM / EDGE
- CDMA / CDMA2000
- W-CDMA HSPA / HSPA+
- TD-SDCMA
- LTE TDD / FDD
- LTE-Advanced
- LTE IoT UE categories Cat 1, Cat 0 (Cat M1) and Cat NB1 (NB-IoT)
- Wi-Fi, 802.11a/b/g/j/n/p
- Wi-Fi, 802.11af/ah
- Bluetooth®, Classic (1.x, 2.x, 3.0), Low Energy (4.0, 4.1, 4.2) and Bluetooth® 5
- Zigbee, Z-Wave and Wi-SUN
- DECT
- LTE
- LPWAN, Sigfox / LoRa
- Navigation (carrier-to-noise): GPS, GLONASS, Compass
When & Where to Use the IQxstream-M for Testing?
- In manufacturing environments
- For products in the PCB-level manufacturing, RF modules or end-of-line manufacturing lifecycle stages
- For mobile or IoT devices
